Related references
Note: Only part of the references are listed.Mechanical characterizations of single-crystalline (Cu, Ni)6Sn5 through uniaxial micro-compression
J. Y. Wu et al.
MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING (2019)
A Study on the Optimization of Anisotropic Conductive Films for Sn-3Ag-0.5Cu-Based Flex-on-Board Application at a 250 °C Bonding Temperature
Shuye Zhang et al.
IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY (2018)
A Study on the Failure Mechanism and Enhanced Reliability of Sn58Bi Solder Anisotropic Conductive Film Joints in a Pressure Cooker Test Due to Polymer Viscoelastic Properties and Hydroswelling
Shuye Zhang et al.
IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY (2016)
Characterization of Wafer-Level Au-In-Bonded Samples at Elevated Temperatures
Thi-Thuy Luu et al.
METALLURGICAL AND MATERIALS TRANSACTIONS A-PHYSICAL METALLURGY AND MATERIALS SCIENCE (2015)
A Study on the Solder Ball Size and Content Effects of Solder ACFs for Flex-on-Board Assembly Applications Using Ultrasonic Bonding
Shuye Zhang et al.
IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY (2015)
Growth of intermetallic compounds in the Au-In system: Experimental study and 1-D modelling
L. Deillon et al.
ACTA MATERIALIA (2014)
Low-Temperature Bonded Cu/In Interconnect With High Thermal Stability for 3-D Integration
Yu-San Chien et al.
IEEE TRANSACTIONS ON ELECTRON DEVICES (2014)
Fluxless Tin and Silver-Indium Bonding Processes for Silicon onto Aluminum
Chin C. Lee et al.
JOURNAL OF ELECTRONIC MATERIALS (2014)
Thermal Cycling Reliability Study of Ag-In Joints Between Si Chips and Cu Substrates Made by Fluxless Processes
Yuan-Yun Wu et al.
IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY (2014)
Bonding Silicon Chips to Aluminum Substrates Using Ag-In System Without Flux
Yuan-Yun Wu et al.
IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY (2013)
Nanomechanical responses of intermetallic phase at the solder joint interface - Crystal orientation and metallurgical effects
Jenn-Ming Song et al.
MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING (2012)
Fluxless Bonding of Bismuth Telluride Chips to Alumina Using Ag-In System for High Temperature Thermoelectric Devices
Wen P. Lin et al.
IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY (2011)
Silver Microstructure Control for Fluxless Bonding Success Using Ag-In System
Pin J. Wang et al.
IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES (2010)
Transient Liquid Phase Die Attach for High-Temperature Silicon Carbide Power Devices
Habib A. Mustain et al.
IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES (2010)
Time-dependent deformation behavior of interfacial intermetallic compound layers in electronic solder joints
Jenn-Ming Song et al.
JOURNAL OF MATERIALS RESEARCH (2010)
A Review on Die Attach Materials for SiC-Based High-Temperature Power Devices
Hui Shun Chin et al.
METALLURGICAL AND MATERIALS TRANSACTIONS B-PROCESS METALLURGY AND MATERIALS PROCESSING SCIENCE (2010)
High-Temperature Lead-Free Solders: Properties and Possibilities
Katsuaki Suganuma et al.
JOM (2009)
Study of Low-Temperature Thermocompression Bonding in Ag-In Solder for Packaging Applications
Riko I. Made et al.
JOURNAL OF ELECTRONIC MATERIALS (2009)
Interfacial Reactions of Si Die Attachment with Zn-Sn and Au-20Sn High Temperature Lead-Free Solders on Cu Substrates
Seongjun Kim et al.
JOURNAL OF ELECTRONIC MATERIALS (2009)
Mechanical behavior of Au-In intermetallics for low temperature solder diffusion bonding
Jie Lian et al.
JOURNAL OF MATERIALS SCIENCE (2009)
Strain Rate Dependence on Nanoindentation Responses of Interfacial Intermetallic Compounds in Electronic Solder Joints with Cu and Ag Substrates
Jenn-Ming Song et al.
MATERIALS TRANSACTIONS (2009)
Study of the Au/In reaction for transient liquid-phase bonding and 3D chip stacking
W. Zhang et al.
JOURNAL OF ELECTRONIC MATERIALS (2008)
High-temperature operation of SiC power devices by low-temperature sintered silver die-attachment
John Guofeng Bai et al.
IEEE TRANSACTIONS ON ADVANCED PACKAGING (2007)
Transfer of metal MEMS packages using a wafer-level solder transfer technique
WC Welch et al.
IEEE TRANSACTIONS ON ADVANCED PACKAGING (2005)
Deformation behavior of (Cu, Ag)-Sn intermetallics by nanoindentation
X Deng et al.
ACTA MATERIALIA (2004)
Computational modeling of the forward and reverse problems in instrumented sharp indentation
M Dao et al.
ACTA MATERIALIA (2001)
Fluxless process of fabricating In-Au joints on copper substrates
WW So et al.
IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES (2000)