4.5 Article

3D aluminum/silver hierarchical nanostructure with large areas of dense hot spots for surface-enhanced raman scattering

Journal

ELECTROPHORESIS
Volume 40, Issue 23-24, Pages 3123-3131

Publisher

WILEY
DOI: 10.1002/elps.201900285

Keywords

3D Al; Ag plasmonic nanostructure; dense hot spots; large area; surface-enhanced Raman scattering

Funding

  1. Natural Science Foundation of Shandong Province [ZR2016FQ05, ZR2018MA044, ZR2018PF013]
  2. National Natural Science Foundation of China (NSFC) [11504386, 61775089, 61574071]
  3. Alliance Fund of Shandong Provincial Key Laboratory [SDKL2016038]

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Plasmonic nanomaterials possessing large-volume, high-density hot spots with high field enhancement are highly desirable for ultrasensitive surface-enhanced Raman scattering (SERS) sensing. However, many as-prepared plasmonic nanomaterials are limited in available dense hot spots and in sample size, which greatly hinder their wide applications in SERS devices. Here, we develop a two-step physical deposition protocol and successfully fabricate 3D hierarchical nanostructures with highly dense hot spots across a large scale (6 x 6 cm(2)). The nanopatterned aluminum film was first prepared by thermal evaporation process, which can provide 3D quasi-periodic cloud-like nanostructure arrays suitable for noble metal deposition; then a large number of silver nanoparticles with controllable shape and size were decorated onto the alumina layer surfaces by laser molecular beam epitaxy, which can realize large-area accessible dense hot spots. The optimized 3D-structured SERS substrate exhibits high-quality detection performance with excellent reproducibility (13.1 and 17.1%), whose LOD of rhodamine 6G molecules was 10(-9) M. Furthermore, the as-prepared 3D aluminum/silver SERS substrate was applied in detection of melamine with the concentration down to 10(-7) M and direct detection of melamine in infant formula solution with the concentration as low 10 mg/L. Such method to realize large-area hierarchical nanostructures can greatly simplify the fabrication procedure for 3D SERS platforms, and should be of technological significance in mass production of SERS-based sensors.

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