Journal
COMPOSITES PART A-APPLIED SCIENCE AND MANUFACTURING
Volume 125, Issue -, Pages -Publisher
ELSEVIER SCI LTD
DOI: 10.1016/j.compositesa.2019.105496
Keywords
Spherical alumina; Carbon nanotubes; Silica nanoparticles; Thermal conductivity
Funding
- National Natural Science Foundation of China [51673063, 21878092, 21838003, 91834301]
- Shanghai Scientific and Technological Innovation Project [18JC1410500]
- Social Development Program of Shanghai [17DZ1200900, 18DZ2252400]
- Program of Shanghai Academic Research Leader [19XD1401400]
- Innovation Program of Shanghai Municipal Education Commission
- Fundamental Research Funds for the Central Universities [222201718002]
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Achieving highly out-plane TC composites by building thermal conductive network at possible low content of conductive fillers is crucial and urgent to realize miniaturization, integration, and high-power density of electronic devices. In this study, highly thermal conductive composites based on pre-selected size of micro-Al2O3 (20 mu m and 70 mu m), acidified MWCNTs and silica nanoparticles (SiO2 NPs) are fabricated via a facile mixing process. Enhanced thermal conductive network was constructed by small functionalized Al2O3 (f-Al2O3) particles gap filling between large f-Al2O3 particles and the MWCNTs connection with adjacent f-Al(2)O(3 )particles. SiO2 NPs are used to avoid the sedimentation of f-Al2O3 particles and improve the dispersion of MWCNTs. The obtained composites show very high out-plane TC (1.73 W.m(-1).K-1) at only 60 wt% Al2O3 (20 mu m/70 mu m: mass fraction, 1/3), 3 wt% MWCNTs and 8 wt% SiO2. It is attributed to the synergistic effect of different size of f-Al2O3 and the MWCNTs to form the dense thermal conduction path. The high out-plane TC and low electric conductivity provide this material great potential as candidate for heat dissipation parts in electronic devices.
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