Journal
ACS APPLIED MATERIALS & INTERFACES
Volume 11, Issue 47, Pages 44811-44819Publisher
AMER CHEMICAL SOC
DOI: 10.1021/acsami.9b11690
Keywords
Ag+ complex; electroless copper deposition; ultrafine conductive patterns; flexible electronics; fatigue resistance
Funding
- National Natural Science Foundation of China [21603027, 61974020, 61604034, 51801018]
- Jiangxi Province Science & Technology Project [20181ACE50001]
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Firm immobilization of catalysts on the predesigned position over substrates is an essential process for producing flexible circuits by the electroless deposition (ELD) process. In this work, a compatible Ag+ complex was developed and directly printed on the poly(ethylene terephtalate) (PET) film through a micro inkjet printing instrument to trigger the deposition of ultrafine copper patterns with approximately 20 mu m in width. Morphological and elementary characterization verified that the nanosized silver catalyst was uniformly distributed in the bridge layer, which could enhance the adhesion between the PET film and deposited copper patterns. Moreover, after 30 min of ELD, the copper patterns exhibited a low resistivity of 2.68 X 10(-6) Omega.cm and maintained considerable conductivity even after 2000 times of cyclical bending. These interesting conductive and mechanical features demonstrate the tremendous potential of this Ag+ complex-assisted copper deposition in the interconnection of high-density integrated flexible electronics.
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