Low-temperature sintering of silver nanoparticles on paper by surface modification

Ultralow-temperature sintering plays a vital role in the development of flexible printed electronics, which improves flexibility and reduces energy consumption. This study investigates the ultralow-temperature sintering of large-sized silver nanoparticles (Ag NPs) by laser modification of the substrate surface. Ag NPs in conductive ink were sintered at only 60 degrees C. Designing the appropriate size of modified regions, the sintered Ag layer exhibits a sheet resistance of only 0.274 Omega and withstands 10 000 folding cycles. Energy-dispersive x-ray spectroscopy showed that TiO2 formed by laser ablation promotes the sintering of Ag NPs and joining with the substrate. A paper-based flexible integrated circuit board was also prepared.