Journal
COMPOSITES PART A-APPLIED SCIENCE AND MANUFACTURING
Volume 123, Issue -, Pages 260-269Publisher
ELSEVIER SCI LTD
DOI: 10.1016/j.compositesa.2019.05.024
Keywords
Aluminum particle; Thermal conductivity; Insulation property; Thermal interface materials
Funding
- National Key R&D Program of China [2017YFB0406000]
- National Natural Science Foundation of China [51603226]
- Frontier Sciences Key Research Program of the Chinese Academy of Sciences [QYZDY-SSWJSC010]
- Guangdong Provincial Key Laboratory [2014B030301014]
- Shenzhen International Collaborative Innovation Programs [GJHZ20180420180909654]
- Guangdong province industrial-academic-research cooperation program [2014 B 090901017]
- Science and Technology Planning Project of Guangdong Province, China [2017A010106005]
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With the miniaturization, high power density, and high integration of modern electronics, heat accumulation has emerged as a critical issue that affects their performance and reliability. The application of thermal interface materials is a common thermal management strategy. Herein, we report thermally conductive and insulating thermal interface materials composed of core-shell structured Al@Al2O3 and epoxy resin. The composites exhibit thermal conductivity of 0.92 W m(-1) K-1 at 60 wt% filler contents, which is about 4.2 times higher than that of the epoxy resin. The oxidation of Al particles results in the formation of dense nanoscale insulating Al2O3 shell, which effectively restricts the electron transfer, thus leading to a very high electrical resistivity and puncture voltage of the composites. The polymer composites filled with Al@Al2O3 particles have excellent insulation property, high thermal conductivity and outstanding thermos-mechanical performance, which could be a potential thermal interface material in advanced electronic packaging techniques.
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