Journal
CHEMICAL ENGINEERING JOURNAL
Volume 370, Issue -, Pages 166-175Publisher
ELSEVIER SCIENCE SA
DOI: 10.1016/j.cej.2019.03.217
Keywords
Spherical boron nitride; Spray-assisted assembly; Polymer; Thermal conductivity
Categories
Funding
- National Key R&D Program of China [2017YFB0406200]
- National Natural Science Foundation of China [51603226]
- Frontier Sciences Key Research Program of the Chinese Academy of Sciences [QYZDY-SSWJSC010]
- Guangdong Provincial Key Laboratory [2014B030301014]
- Shenzhen Science & Technology Program [JSGG 20160229155249762]
- Guangdong province industrial-academic-research cooperation program [2014 B 090901017]
- Guangzhou industrial-academic-research cooperation program [201508010031]
- Science and Technology Planning Project of Guangdong Province, China [2017A010106005]
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Owing to its unique properties, such as electrical insulation, high thermal conductivity, high breakdown strength, physical and chemical stability, boron nitride has been used widely as fillers to improve the thermal conductivity of polymers. However, the addition of very small boron nitride leads to a dramatic increase of viscosity of polymer composites. The increased viscosity will limit the amount of boron nitride in polymers, which results in limited increase of thermal conductivity for polymer composites. To this end, we developed a spray-assisted self-assembly method to prepare spherical boron nitride. The spherical boron nitride improves the thermal conductivity of polydimethylsiloxane, in contrast to boron nitride platelets, which is attributed to its structural characteristics. The thermal conductivity of spherical boron nitride/polydimethylsiloxane is up to 2.30 W/mK, almost four times of that of platelet-like BN/polydimethylsiloxane composite at the 50 wt% filler content. This simple and versatile method is therefore directly relevant to the future design of practical polymer composites for heat removal of modern electronics.
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