Journal
ACS NANO
Volume 13, Issue 9, Pages 9713-9734Publisher
AMER CHEMICAL SOC
DOI: 10.1021/acsnano.9b02540
Keywords
two-dimensional materials; transition-metal dichalcogenides; surface engineering; interface engineering; contact engineering; molecular treatment; organic molecules; organic polymers; electric transport properties; charge injection properties
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Funding
- National Creative Research Laboratory Program by the Ministry of Science and ICT of Korea [2012026372]
- Korea Institute of Science and Technology (KIST) Future Resource Research Program [2E29520]
- National Research Foundation of Korea (NRF) - Ministry of Science and ICT of Korea [NRF-2017R1C1B2002323]
- National Research Foundation of Korea [2E29520] Funding Source: Korea Institute of Science & Technology Information (KISTI), National Science & Technology Information Service (NTIS)
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The interface engineering of two-dimensional (2D) transition-metal dichalcogenides (TMDs) has been regarded as a promising strategy to modulate their outstanding electrical and optoelectronic properties because of their inherent 2D nature and large surface-to-volume ratio. In particular, introducing organic molecules and polymers directly onto the surface of TMDs has been explored to passivate the surface defects or achieve better interfacial properties with neighboring surfaces efficiently, thus leading to great opportunities for the realization of high-performance TMD-based applications. This review provides recent progress in the interface engineering of TMDs with organic molecules and polymers corresponding to the modulation of their electrical and optoelectronic characteristics. Depending on the interfaces between the surface of TMDs and dielectric, conductive contacts or the ambient environment, we present various strategies to introduce an organic interlayer from materials to processing. In addition, the role of native defects on the surface of TMDs, such as adatoms or vacancies, in determining their electrical characteristics is also discussed in detail. Finally, the future challenges and opportunities associated with the interface engineering are highlighted.
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