4.8 Article

Constructing a Novel Electroluminescent Device with High-Temperature and High-Humidity Resistance based on a Flexible Transparent Wood Film

Journal

ACS APPLIED MATERIALS & INTERFACES
Volume 11, Issue 39, Pages 36010-36019

Publisher

AMER CHEMICAL SOC
DOI: 10.1021/acsami.9b09331

Keywords

low coefficient of thermal expansion; flexible electroluminescent devices; silver nanowire; transparent electrode; veneer

Funding

  1. National Natural Science Foundation of China [31870549]
  2. Jiangsu Nature Science Foundation [BK20161524]
  3. Postgraduate Research & Practice Innovation Program of Jiangsu Province [KYCX17 839]
  4. start-up funds for scientific research at the Nanjing Forestry University [163020126]

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Plastic-based electroluminescent devices generally suffer from thermal expansion owing to the high coefficient of thermal expansion (CTE) of the plastic substrate, which reduces the service lifetime of the electroluminescent device. In this study, we employed a delignified veneer synergistically reinforced with epoxy resin as a low-cost substrate for alternating current electroluminescent (ACEL) devices. In brief, the natural interconnected porous structure of wood had a good antideformation capacity to restrict the volume expansion of the epoxy resin under thermal conditions. Furthermore, the impregnation of epoxy resin dramatically improved the optical transmittance of delignified veneer. Considering its low CTE and antideformation capability, the intrinsically high-temperature and high-humidity resistance device based on transparent sliced veneer (TSV) was constructed. Remarkably, the TSV-ACEL device exhibited excellent stability and maintained good luminescence performance even at a high temperature (100 degrees C, 30 min; as a reference, the poly(ethylene terephthalate)-based ACEL device has stopped operating), completely submerged in water (30 min), or under high-temperature and high-humidity conditions (90 degrees C, relative humidity: >90%, 30 min). These results pave the way for the realization of flexible and high-temperature resistance ACEL devices.

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