One-step electrodeposition of copper on conductive 3D printed objects

3D printing with electrically conducive filaments enables rapid prototyping and fabrication of electronics, but the performance of such devices can be limited by the fact that the most conducive thermoplastic-based filaments for 3D printing are 3750 times less conducive than copper. This study explores the use of one-step electrodeposition of copper onto electrically conducive 3D printed objects as a way to improve their conductivity and performance. Comparison of three different commercially-available conducive filaments demonstrates that only the most conducive commercially available filament could enable one-step electrodeposition of uniform copper films. Electrodeposition improved the electrical conductivity and the ampacity of 3D printed traces by 94 and 17 times respectively, compared to the as-printed object. The areal surface roughness of the objects was reduced from 9.3 to 6.9 mu m after electrodeposition, and a further reduction in surface roughness to 3.9 mu m could be achieved through the addition of organic additives to the electrodeposition bath. Copper electrodeposition improved the quality factor of a 3D printed inductor by 1740 times and the gain of a 3D printed horn antenna by 1 dB. One-step electrodeposition is a fast and simple way to improve the conductivity and performance of 3D printed electronic components.