Tensile behavior and flow stress anisotropy of accumulative roll bonded Cu-Nb nanolaminates

The flow stress, ductility, and in-plane anisotropy are evaluated for bulk accumulative roll bonded copper-niobium nanolaminates with layer thicknesses ranging from 1.8 mu m to 15 nm. Uniaxial tensile tests conducted parallel to the rolling direction and transverse direction demonstrate that ductility generally decreases with decreasing layer thickness; however, at 30 nm, both high strengths (1200 MPa) and significant ductility (8%) are achieved. The yield strength increases monotonically with decreasing layer thickness, consistent with the Hall-Petch relationship, and significant in-plane flow stress anisotropy is observed. Taylor polycrystal modeling is used to demonstrate that crystallographic texture is responsible for the in-plane anisotropy and that the effects of texture dominate even at nanoscale layer thicknesses. (C) 2016 AIP Publishing LLC.