Three-dimensional Cu microfabrication using femtosecond laser-induced reduction of CuO nanoparticles

Three-dimensional Cu microstructures were formed using a combined process of dispensing coating and femtosecond laser-induced reduction of CuO nanoparticles. Layer-by-layer lamination of two-dimensional Cu micropatterns was performed by alternately coating with a CuO nanoparticle solution and using direct laser writing, followed by the removal of nonirradiated CuO nanoparticles. The resistance of the 3D microstructures decreased as the number of layers increased, indicating that each layer was electrically connected to the others. We also demonstrated the fabrication of a microbridge heater composed of electrode pads and a microbridge, and found that its heating characteristics are suitable for use in microsensors, such as thermal-type flow sensors. (C) 2017 The Japan Society of Applied Physics