Efficient heat conducting liquid metal/CNT pads with thermal interface materials

Ga-Based thermal interface material (TIM) pads/sheets with high thermal conductivity () are indispensable components in thermal management systems. Here, we present a feasible method to fabricate heat conduction pads, which are composed of carbon nanotubes embedded into a liquid metal (LM). This setup has resulted in a large increase of reaching approximate to 14.2 WmK-1, greater than that of most of the commercial thermal silicone pads (approximate to 5mK-1). In addition, a series of experiments were conducted on smartphones to evaluate the heat dissipation performance of the CPU. It turned out that LM/nanotube pads with TIMs show distinguish thermal conductivity performance.