4.7 Article

Effects of interface area density and solid solution on the microhardness of Cu-Nb microcomposite wires

Journal

MATERIALS CHARACTERIZATION
Volume 150, Issue -, Pages 62-66

Publisher

ELSEVIER SCIENCE INC
DOI: 10.1016/j.matchar.2019.02.002

Keywords

Cu-Nb microcomposite wires; Interface; Solid solution; Microhardness

Funding

  1. National Natural Science Foundation of China [51601039]
  2. Natural Science Foundation of Fujian Province of China [2016J05119]
  3. Major special project of Fujian Science and Technology Program [2017HZ0001-2]
  4. Fuzhou University Testing Fund [2018T018]
  5. National High Magnetic Field Laboratory through US National Science Foundation [DMR-1157490]
  6. Fujian Provincial Collaborative Innovation Center for High-end Equipment Manufacturing

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Cu-Nb microcomposite wires drawn to different strain values were studied by means of scanning electron microscopy and transmission electron microscopy. The Cu and Nb near the interfaces show a typical Kurdjumov-Sachs relationship with a deviation angle of 12 degrees. This deviation accommodates internal stresses and slip discontinuity between Cu and Nb. The dislocations are mainly stored around the interface near the Cu matrix. Lattice distortion occurred near the interfaces, where Nb is believed to mix into Cu matrix. Microhardness is affected by interface area density as well as by strain-induced lattice distortion, which can produce a supersaturated solid solution.

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