Journal
JOURNAL OF THE TAIWAN INSTITUTE OF CHEMICAL ENGINEERS
Volume 97, Issue -, Pages 406-413Publisher
ELSEVIER SCIENCE BV
DOI: 10.1016/j.jtice.2019.01.018
Keywords
Facile method; Electroless plating; Selectivity; Flexibility; Copper
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Funding
- Research Foundation of Hefei University [17ZR03ZDA]
- State Key Laboratory of Rare Earth Permanent Magnetic Materials [SKLREPM17OF05]
- opening project of Guangxi Key Laboratory of Calcium Carbonate Resources Comprehensive Utilization [HZXYKFKT201805]
- Natural Science Research Project of Anhui Provincial Education Department [KJ2016A597]
- Anhui Provincial Natural Science Foundation [1808085ME144]
- Doctor's Scientific Research Foundation of Hezhou University [HZUJS201512]
- Special Foundation for Innovation-driven Development of Hezhou [PT0710004]
- Guangxi Natural Science Foundation [2018JJA160124]
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In this work, a facile method combined with catalyst solution (mixture of AgNO3, 3-aminopropyltriethoxysilane, alcohol, SiO2 particle and deionized water) printing and electroless deposition to fabricate selective copper coating is demonstrated. The catalyst solution can write onto (polyethylene terephthalate (PET)) surface directly with good stability and resolution. The structure can catalyze plating reaction. SiO2 particle can enhance surface roughness (S-r) of catalyst coating. Effects of S-r on electronic, adhesive force and structural properties of copper coating are investigated. High S-r can facilitate the enhancement of Ag-adsorbed amount, deposition rate, adhesive force, crystallinity and electrical stability of plated coating. When the S-r is 0.78 mu m, the thickness of copper coating is 2.5 mu m, minimum width of copper line is 250 mu m, the resistivity is 2.1 x 10(-6) Omega cm, adhesion of 2.5 mu m thick coating is 5B. (C) 2019 Taiwan Institute of Chemical Engineers. Published by Elsevier B.V. All rights reserved.
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