Journal
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS
Volume 30, Issue 10, Pages 9767-9774Publisher
SPRINGER
DOI: 10.1007/s10854-019-01313-0
Keywords
-
Categories
Funding
- Research Foundation of Hefei University [17ZR03ZDA]
- State Key Laboratory of Rare Earth Permanent Magnetic Materials [SKLREPM17OF05]
- Opening project of Guangxi Key Laboratory of Calcium Carbonate Resources Comprehensive Utilization [HZXYKFKT201805]
Ask authors/readers for more resources
It is highly desired to simplify the technology of electroless plating on inert polymer. Herein we developed a new kind of catalytic solution (mixture of H2O, AgNO3 and 3-aminopropyltriethoxysilane), which can write onto inert polymer directly with good stability, resolution and catalytic performance. Then, a facile method combined with catalyst solution printing and electroless plating to fabricate selective metal (copper and nickel) coating on polymer (polypropylene and polyethylene terephthalate) surface. The growthbehavior, electrical, and structural properties of plated coating were investigated. The minimum width of copper coating is 250m, thickness is 2.2m, resistivity is 2.6x10(-6)cm, adhesion of 2.2m thick coating maintain 5B. In addition, the selective metal coating have excellent bending and fatigue resistance.
Authors
I am an author on this paper
Click your name to claim this paper and add it to your profile.
Reviews
Recommended
No Data Available