Journal
ADVANCED ELECTRONIC MATERIALS
Volume 5, Issue 5, Pages -Publisher
WILEY
DOI: 10.1002/aelm.201800991
Keywords
Cu metal-mesh; high aspect ratio; high resolution; transparent conductive film
Funding
- National Program on Key Research Project [2016YFB0401500]
- National Natural Science Foundation of China [U1605244]
- Program on Key Research Project of Jiangsu Province of China [BE2016173]
- National Science Foundation of China [51603228]
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Figure of merit (FOM), the ratio of electrical conductance to optical transparency, is an important metric to evaluate transparent conductive film (TCF). The conductivity of commonly used flexible TCF such as indium tin oxide is generally limited and their FOM is lower than 300. In this study, a high-performance copper (Cu) metal-mesh TCF with the highest FOM ever reported, up to 8 x 10(4), is fabricated through an additive manufacturing process of blading a silver seed layer and selective electroplating of Cu. With this strategy, Cu metallic lines completely constrained in roll-to-roll imprinted microgrooves achieve high aspect ratio of 2 with 4 mu m width and 8 mu m depth, which has very clean and smooth edges. This embedded Cu metal mesh exhibits an ultralow sheet resistance down to 0.03 (-1) at 86% optical transmittance. It is demonstrated that the Cu metal mesh has remarkable mechanical flexibility, high environmental stability at high temperature and humidity, and durability over repeated heating cycles. The Cu metal mesh is employed as a flexible transparent heater to attach to the windshield of a car, showing rapid heating at low voltage and effective removal of snow.
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