Journal
IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY
Volume 9, Issue 1, Pages 146-155Publisher
IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC
DOI: 10.1109/TCPMT.2018.2885637
Keywords
100 Gb/s; 3-D printing; high-speed interconnects; packaging; terahertz (THz); waveguides
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A new waveguiding structure and fabrication technique is introduced for high-speed, low-loss, and ultrawideband interconnects. The proposed structure is a hybrid between a dielectric ribbon and a substrate integrated waveguide design. In this structure, a high-dielectric-constant-valued core is surrounded by a low-dielectric-constant-valued cladding, which in turn is surrounded by a metal layer. Both a substrate integrated ribbon waveguide and a metalized dielectric cylindrical waveguide are presented where the cylindrical waveguide serves as a comparison. Simulation and measurement results show that ultrawideband interconnects with low dispersion, which can be designed using this hybrid approach. Fabrication of the cladding layer was carried out using 3-D plastic printing. Simulated and measured results are discussed as well as fabrication techniques. An example circuit, a power splitter/combiner, is also demonstrated.
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