Journal
MEASUREMENT
Volume 134, Issue -, Pages 897-907Publisher
ELSEVIER SCI LTD
DOI: 10.1016/j.measurement.2018.12.051
Keywords
Lead-free solders; Performance; Microstructure; Corrosion resistance; Cost analysis
Funding
- University of Malaya [RP013B-13AET, RP013A-13AET]
Ask authors/readers for more resources
In the quest for viable alternatives to lead-based solders, electronic industries have started to focus on several potential lead-free solder alloys. After reviewing more than 100 recent studies, the present paper attempts to report the feasibility of various lead-free solder alloys in terms of performance, microstructure, corrosion resistance, and cost analysis. It reveals that there is a lack of scientific data based on which solid decisions on reliable lead-free solders, particularly their composition, can be made. Laboratory tests and data from actual services suggest that Sn-Ag-Cu solder alloys are perhaps the best choices for electronic industries. However, some problems in their practical usage must be addressed. This comprehensive review presents the major shortcomings of lead-free solders and possible solutions. Finally, a number of issues have been reported, which need to be confirmed in further studies. (C) 2018 Published by Elsevier Ltd.
Authors
I am an author on this paper
Click your name to claim this paper and add it to your profile.
Reviews
Recommended
No Data Available