☆
4.6
Article
An investigation of the influence of thermal process on the electrical conductivity of LIFT printed Cu structures
JOURNAL OF PHYSICS D-APPLIED PHYSICS (2019)
Rate this paper
The primary rating indicates the level of overall quality for the paper. Secondary ratings independently reflect strengths or weaknesses of the paper.
Discover Peeref hubs
Discuss science. Find collaborators. Network.
Join a conversationAdd your recorded webinar
Do you already have a recorded webinar? Grow your audience and get more views by easily listing your recording on Peeref.
Upload Now