Journal
INTERNATIONAL JOURNAL OF MOLECULAR SCIENCES
Volume 20, Issue 3, Pages -Publisher
MDPI
DOI: 10.3390/ijms20030746
Keywords
magnetorheological elastomers; epoxidized natural rubber; thermal properties; thermal stability; rheological properties
Funding
- Ministry of Education Malaysia
- Universiti Teknologi Malaysia under PRGS [4L667]
- USAID through Sustainable Higher Education Research Alliances (SHERA) Program-Centre for Collaborative (CCR) National Center for Sustainable Transportation Technology (NCSTT) [IIE00000078-ITB-1]
- Universitas Sebelas Maret (UNS) through Hibah Mandatory 2019
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Determination of the thermal characteristics and temperature-dependent rheological properties of the magnetorheological elastomers (MREs) is of paramount importance particularly with regards to MRE applications. Hitherto, a paucity of temperature dependent analysis has been conducted by MRE researchers. In this study, an investigation on the thermal and rheological properties of epoxidized natural rubber (ENR)-based MREs was performed. Various percentages of carbonyl iron particles (CIPs) were blended with the ENR compound using a two roll-mill for the preparation of the ENR-based MRE samples. The morphological, elemental, and thermal analyses were performed before the rheological test. Several characterizations, as well as the effects of the strain amplitude, temperature, and magnetic field on the rheological properties of ENR-based MRE samples, were evaluated. The micrographs and elemental results were well-correlated regarding the CIP and Fe contents, and a uniform distribution of CIPs was achieved. The results of the thermal test indicated that the incorporation of CIPs enhanced the thermal stability of the ENR-based MREs. Based on the rheological analysis, the storage modulus and loss factor were dependent on the CIP content and strain amplitude. The effect of temperature on the rheological properties revealed that the stiffness of the ENR-based MREs was considered stable, and they were appropriate to be employed in the MRE devices exposed to high temperatures above 45 degrees C.
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