Journal
IEICE TRANSACTIONS ON ELECTRONICS
Volume E102C, Issue 2, Pages 176-179Publisher
IEICE-INST ELECTRONICS INFORMATION COMMUNICATIONS ENG
DOI: 10.1587/transele.2018OMS0009
Keywords
gold leaf; gold powder; gold particles; conductive ink; percolation network
Categories
Funding
- JSPS KAKENHI [JP16K21061, JP18K05256]
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In this work, gold powder made from gold leaf investigated to have the potential as a filler of conductive ink. The resistance of a conductive film decreased from 6.2 k Omega to 1 Omega by adding only 2.0 wt% of gold powder to conductive polymer (PEDOT:PSS) ink. The change of the resistance depends on the characteristics of gold powder. Gold powder with smaller and uniform sizes and good dispersibility is beneficial to form a continuous percolation network.
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