Journal
ACTA MATERIALIA
Volume 164, Issue -, Pages 390-399Publisher
PERGAMON-ELSEVIER SCIENCE LTD
DOI: 10.1016/j.actamat.2018.11.001
Keywords
Alumina; Dynamic grain growth; High-pressure spark plasma sintering; Strain rate
Funding
- Israel Ministry of Defense [440243997/634]
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Applying high pressure during the sintering of ceramic materials is a common practice that allows for a reduction of the sintering temperature and the obtaining of fine-grained microstructures. In this work, we show that the final grain size of submicron alumina increased consistently with applied pressure during low temperature (1000-1050 degrees C), high pressure (500-800 MPa) spark plasma sintering. Grain size trajectories and microstructural observations indicated that stress-enhanced grain growth occurred during the final stage of the sintering process, whereas thermally controlled grain boundary migration was negligible. We suggest that this dynamic, stress-enhanced grain growth is controlled by grain-boundary sliding, grain rotation and coalescence. A strong correlation was found between calculated creep strain rates and grain growth rates, such as during superplastic deformation. (C) 2018 Acta Materialia Inc. Published by Elsevier Ltd. All rights reserved.
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