Journal
APPLIED SCIENCES-BASEL
Volume 8, Issue 12, Pages -Publisher
MDPI
DOI: 10.3390/app8122703
Keywords
Sn/Cu solder joint; intermetallic compounds; void; electroplated Cu; Cu addition
Categories
Funding
- National Natural Science Foundation of China [51805316, 51805315, 51605276]
- Shanghai Science and Technology Development Funds [18FY1424900]
- Shanghai Science and Technology Committee Innovation Grant [17JC1400600, 17JC1400601]
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In this work, the effects of electroplated Cu (EP Cu) and Cu addition (0.7%) in Sn solder on the intermetallic compounds (IMCs) growth and void formation were clarified by comparison with solder joints comprising of high purity Cu (HP Cu) substrate and pure Sn solder. After aging processes, a new IMC, Cu3Sn, was formed at the interface, in addition to Cu6Sn5 formed in the as-soldered joints. The EP Cu and Cu addition (0.7%) both had limited effects on the total IMCs thickness. However, the effects varied on the growth behaviors of different IMCs. Comparing to the void-free interface between Sn and HP Cu, a large number of voids were observed at the Cu3Sn/Cu interface in Sn/EP Cu joints. The formation of these voids may be induced by the impurities and fine grain, which were introduced during the electroplating process. The addition of Cu suppressed the inter-diffusion of Cu and Sn at the interface. Consequently, the growth of the Cu3Sn layer and formation of voids were suppressed.
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