Journal
THIN SOLID FILMS
Volume 669, Issue -, Pages 641-658Publisher
ELSEVIER SCIENCE SA
DOI: 10.1016/j.tsf.2018.11.016
Keywords
Electroless deposition; Reducing agents; Copper films; Non-conducting substrate
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Funding
- Department of Science & Technology, Govt. of India
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This paper reviews recent progress on electroless copper deposition, primarily on non-conducting substrate surfaces including glass, polymers and resins for applications in electrical and electronics products and services. The review focuses on the research of bath parameters that affect the film fabrication process which influences the physical, chemical and electrical properties of the deposits. Fundamental aspects underlying the coating process are described in detail with the aim of summarizing existing application and highlighting new areas for future research. Finally, a comparison between electroless and electrodeposition technology is presented in order to evaluate their suitability for industrial technologies.
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