4.3 Article

Nanoporous Copper Pattern Fabricated by Electron Beam Irradiation on Cu3N Film for SERS Application

Journal

Publisher

WILEY-V C H VERLAG GMBH
DOI: 10.1002/pssb.201800378

Keywords

copper nitride; metalization; nanoporous copper; surface-enhanced Raman scattering

Funding

  1. Deutsche Forschungsgemeinschaft (German Research Foundation) [FOR 1713, SCHM 1298/22-1]
  2. Foundation of the Zhejiang Educational Committee [GKY201329752]
  3. Zhejiang Provincial Natural Science Foundation of China [QY18A040002]
  4. National Natural Science Foundation of China [11574266]

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Copper nanostructures have aroused extensive research interests due to their wide applications in electronics, catalysis, and photonics. Here, a novel strategy to fabricate copper nanoporous structures by illuminating electron beam on as-prepared copper nitride thin films is reported. This electron beam-based direct writing method provides a precise control of the nanoporous sites on substrates. Experimental results reveal significant surface-enhanced Raman scattering (SERS) for copper porous nanostructures compared with flat copper nitride thin films due to localized surface plasmon resonances supported at the nanopores. This work provides a maskless method to prepare copper nanoporous structures from copper nitride films and implies an efficient SERS platform for sensitive molecular diagnostics.

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