Patterned Taping: A High-Efficiency Soft Lithographic Method for Universal Thin Film Patterning

As a universal lithographic technique for microscale/nanoscale film patterns, we develop a strategy for the use of soft lithographically patterned pressure sensitive tape (patterned tape) as a pattern-transporting stamp material. Patterning was successfully implemented through the selective detachment and/or attachment of various thin films, including organic and metallic layers demanding no subsequent physical, thermal, or chemical treatment, as this incurs the risk of the deformation of the thin film and the deterioration of its functionalities. Its features of universal adhesion and flexibility enable pressure-sensitive tapes to form patterns on a variety of surfaces: organic, polymeric, and inorganic surfaces as well as flat, curved, uneven, and flexible substrates. Moreover, the proposed technique boasts the unique and distinct advantages of short operation time, supreme patterning yield, and multilayer stacking capability, which suggest considerable potential for their application to advanced optoelectronic device fabrication.