4.8 Article

A Flexible and Robust Transparent Conducting Electrode Platform Using an Electroplated Silver Grid/Surface-Embedded Silver Nanowire Hybrid Structure

Journal

ACS APPLIED MATERIALS & INTERFACES
Volume 8, Issue 40, Pages 27035-27043

Publisher

AMER CHEMICAL SOC
DOI: 10.1021/acsami.6b07140

Keywords

electroplating; metal grid; silver nanowire; transparent conducting electrode; touch-screen panel

Funding

  1. Wearable Platform Materials Technology Center (WMC) - National Research Foundation of Korea (NRF) Grant of the Korean Government (MSIP) [NRF-2016R1A5A1009926, NRF-2015R1A2A1A15056057]
  2. Korea Evaluation Institute of Industrial Technology [10051337]
  3. Korea Evaluation Institute of Industrial Technology (KEIT) [10051337] Funding Source: Korea Institute of Science & Technology Information (KISTI), National Science & Technology Information Service (NTIS)
  4. National Research Foundation of Korea [2016R1A5A1009926] Funding Source: Korea Institute of Science & Technology Information (KISTI), National Science & Technology Information Service (NTIS)

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In this paper, we report flexible transparent conducting electrode (TCE) film using a silver grid (Ag grid)/silver nanowire (AgNW) hybrid structure (AG/NW-GFRHybrimer). The AG/NW-GFRHybrimer consists of an AgNW-embedded glass-fabric reinforced plastic film (AgNW-GFRHybrimer) and an electroplated Ag grid. The AgNW-GFRHybrimer is used as a flexible transparent substrate and a seed layer for electroplating. The Ag grid is fabricated via an all-solution-process; the grid pattern is formed using conventional photolithography; and Ag is deposited through electroplating. The AG/NW-GFRHybrimer exhibits excellent opto-electrical properties (transparency = 87%, sheet resistance = 13 Omega/square), superior thermal stability (250 degrees C for 720 min and 85 degrees C/85% RH for 100 h); and outstanding mechanical flexibility (bending radius = 1 mm for 2000 cycles). Finally, a touch-screen panel (four-wire resistive type) was fabricated using the AG/NW-GFRHybrimer to demonstrate its potential for use in actual optoelectronic applications.

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