Journal
MATERIALS LETTERS
Volume 235, Issue -, Pages 216-219Publisher
ELSEVIER SCIENCE BV
DOI: 10.1016/j.matlet.2018.09.170
Keywords
Die attach adhesive; Light emitting diode; Thermal properties; Polymeric composites; Light extraction
Funding
- Guangdong Science and Technology Department (China) [2017A010106005, 2017A050506053]
- Guangzhou Science Technology and Innovation Commission (China) [201704030107]
- Hong Kong Innovation and Technology Commission [UIM/241]
- Lumileds (Shanghai) Management Co., Ltd.
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High thermal conductivity, low viscosity and high transparency are desired properties of die attach adhesives (DAA) for LEDs to achieve high thermal and optical performance as well as good reliability. However, it is challenging for DAAs with thermally conductive fillers to keep a low viscosity and high transparency. In this paper, a novel DAA with designed hyper-branched epoxy-silicone and surface modified fused silica was formulated to improve the thermal conductivity without sacrificing high transparency and low viscosity. Compared with a widely used commercial DAA, 165% thermal conductivity improvement and 83% viscosity reduction are achieved, resulting in 26% thermal resistance reduction, 7% light extraction enhancement, and 14% less lumen degradation in accelerate aging test for mid-power LED packages. (C) 2018 Elsevier B.V. All rights reserved.
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