High-Performance, Solution-Processed, Embedded Multiscale Metallic Transparent Conductors

High-performance multiscale metallic transparent conductors (TCs) are demonstrated by incorporating Ag nanowire (NW) networks into mictoscale Ag grid structures. Highly conductive Ag grids are fabricated via direct imprinting of an Ag ion ink using a reservoir-assisted mold. In this mold, a macroscale cavity) called the reservoir, is designed to connect to a grid-patterned cavity. The reservoir has a large cavity volume, which reduces unwanted residual layers within the grid spacings by introducing a thinner liquid film. The reservoir undergoes a large volume reduction during mold deformation, which improves ink filling within the grid patterned cavity through deformation-induced ink injection. The multiscale metallic TCs show a sheet resistance (R-s) of <1.5 Omega/sq and a transmittance (T) of 86% at 550 nm, superior to the corresponding values of Ag NW networks (R-s of 15.6 Omega/sq at a similar T). We estimate the R-s-T performances: of the Ag grids using geometrical calculations and demonstrate that their integration can enhance the opto-eleetrical properties of the Ag NW networks. Multiscale metallic TCs are successfully transferred and embedded into a transparent, flexible, and UV-curable polymer matrix. The embedded multiscale metallic TCs show reasonable electromechanical and chemical stability. The utility of these TCs is demonstrated by fabricating flexible organic solar cells.