Thermal and oxidative behavior of a tetraphenylsilane-containing phthalonitrile polymer

Phthalonitrile polymers have potential for high-temperature applications in polymer matrix composites as electronic encapsulation compounds. To investigate the effect of inclusion of an organosilicon moiety, a tetraphenylsilane-containing phthalonitrile monomer was synthesized in high yields. The monomer possessed a high melting point of 222-223 degrees C, while no hydrolytic sensitivity was observed. Cured polymers exhibited glass transitions in the range of 290-325 degrees C and coefficients of thermal expansion of 73-77 mu m/(m degrees C). In thermogravimetric analysis (TGA), 5 wt% loss was observed at 482-497 degrees C and 519-526 degrees C, under air and nitrogen, respectively. Infrared (IR)-TGA of evolved gases revealed multiple degradations in both nitrogen and air. The material possessed good thermo-oxidative stability (TOS) when aged in air at 250 degrees C. After aging for 5000 h, oxidative degradation was characterized using Fourier transform IR microscopy, energy dispersive spectroscopy, optical microscopy, and Knoop hardness testing. Four zones were identified in aged samples. The cleavage of Si-phenyl bonds and the formation of Si-O phases and carbonyl groups were observed.