4.5 Article

Effects of filler loading and surface modification on electrical and thermal properties of epoxy/montmorillonite composite

Journal

CHINESE PHYSICS B
Volume 27, Issue 11, Pages -

Publisher

IOP PUBLISHING LTD
DOI: 10.1088/1674-1056/27/11/117806

Keywords

modified epoxy resin; surface modification; electric property; thermal property

Funding

  1. National Natural Science Foundation of China [21806129, 51872238, 51407134, 51521065]
  2. China Postdoctoral Science Foundation [2016M590619]
  3. Natural Science Foundation of Shandong Province, China [ZR2016EEQ28]
  4. State Key Laboratory of Electrical Insulation and Power Equipment, China [EIPE14107]
  5. Fundamental Research Funds for the Central Universities, China [3102018zy045]
  6. Natural Science Basic Research Plan in Shaanxi Province, China [2017JQ5116]

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Epoxy-based composites containing montmorillonite (MMT) modified by silylation reaction with gamma-aminopropyltriethoxysilane (gamma-APTES) and 3-(glycidyloxypropyl) trimethoxysilane (GPTMS) are successfully prepared. The effects of filler loading and surface modification on the electrical and thermal properties of the epoxy/MMT composites are investigated. Compared with the pure epoxy resin, the epoxy/MMT composite, whether MMT is surface-treated or not, shows low dielectric permittivity, low dielectric loss, and enhanced dielectric strength. The MMT in the epoxy/MMT composite also influences the thermal properties of the composite by improving the thermal conductivity and stability. Surface functionalization of MMT not only conduces to the better dispersion of the nanoparticles, but also significantly affects the electric and thermal properties of the hybrid by influencing the interfaces between MMT and epoxy resin. Improved interfaces are good for enhancing the electric and thermal properties of nanocomposites. What is more, the MMT modified with GPTMS rather than gamma-APTES is found to have greater influence on improving the interface between the MMT filler and polymer matrices, thus resulting in lower dielectric loss, lower electric conductivity, higher breakdown strength, lower thermal conductivity, and higher thermal stability.

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