Journal
APPLIED PHYSICS LETTERS
Volume 113, Issue 26, Pages -Publisher
AMER INST PHYSICS
DOI: 10.1063/1.5053923
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Funding
- Dow Chemical Company
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Thermal stability is important for many thin film organic semiconductor devices but is challenging due to their weakly Van der Waals-bonded nature. Here, we show that diluting common small molecule hole transport materials through co-evaporation with the amorphous fluoropolymer Teflon AF leads to a dramatic improvement in their thermal and morphological stability without sacrificing electrical performance. Blend films with 25 vol. % Teflon decrease the drive voltage of single layer hole-only devices by more than 30% and dramatically increase their operating temperature limit to over 250 degrees C. The stability improvement appears to result from a nanoscale network of Teflon chains that repolymerize throughout the blend film following evaporation and inhibit gross movement of the organic semiconductor molecules. These results open up a pathway to stabilize the morphology of small molecule organic semiconductors and point to a more general opportunity to exploit semiconductor dilution to systematically vary thermal, optical, and other material properties without compromising electrical transport. Published by AIP Publishing.
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