Journal
ACS APPLIED MATERIALS & INTERFACES
Volume 11, Issue 3, Pages 3231-3240Publisher
AMER CHEMICAL SOC
DOI: 10.1021/acsami.8b19069
Keywords
conductive pastes; stretchable wirings; stretchable bonding; Ag microflakes; recoverability
Funding
- Huawei Innovation Research Program
- Dynamic Alliance for Open Innovation Bridging Human, Environment and Materials from the Ministry of Education, Culture, Sports, Science and Technology of Japan
- JSPS [JP17K14824, PE17020]
- Osaka University Visiting Scholar Program [J135104902]
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Stretchable wiring and stretchable bonding between a rigid chip/component and a stretchable substrate are two key factors for stretchable electronics. In this study, a highly conductive stretchable paste has been developed with commercial Ag microflakes and poly(dimethylsiloxane), which can be used to fabricate stretchable wirings and bondings under a low curing temperature of 100 degrees C with printing method. Herein, recoverabilities as to recovery time and recovery resistance of the wirings are defined and discussed. The effect of Ag composition and the tensile strain rate on the recoverability of the wirings are also examined. The wiring with a low resistivity of 8.7 x 10(-5) Omega cm shows much better recoverability than nanowire-based wirings due to the flake nature of the Ag particles. When stretched to 50 and 100% of strain, the resistance of the patterned wiring increases by only 10 and 110%, respectively. Moreover, the resistance of the wiring during 20% tensile cyclic test remains within 1.1 times even after 1000 cycles, thus demonstrating significant durability. The paste was utilized to fabricate conductive tracks and stretchable bondings to assemble a rigid chip to fabricate a stretchable demo. When stretched to 50% of strain, resistance of the wiring was increased by 90%. It is anticipated that the newly developed paste will be used to fabricate various stretchable wirings, bondings, and packaging structures by a simple printing process, thus enabling mass production of stretchable electronic devices.
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