4.7 Article

Liquid state property, structural evolution and mechanical behavior of Ti - Fe alloy solidified under electrostatic levitation condition

Journal

MATERIALS & DESIGN
Volume 160, Issue -, Pages 48-57

Publisher

ELSEVIER SCI LTD
DOI: 10.1016/j.matdes.2018.08.043

Keywords

Rapid solidification; Titanium alloy; Tbermophysical property; Microstructure; Mechanical property

Funding

  1. National Natural Science Foundation of China [51327901, 51727803, 51571164]
  2. NPU Excellent Personnel Supporting Project
  3. Fundamental Research Fund of Northwestern Polytechnical University [3102018jcc039]

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The thermophysical properties of hypereutectic Ti63.64Fe36.36 alloy at both nomial and undercooled states, including density, volume expansion coefficient, ratio of specific heat to emissivity were measured by electrostatic levitation (ESL) method combined with a high-speed photography technique. The enthalpy, specific heat, solute diffusion coefficient and surface tension were simultaneously calculated as functions of temperature by molecular dynamics simulation (MD), from which the emissivity was also derived. The rapid solidification kinetics in the undercooling range from 50 K to a maximum value of 270 K (0.18T(L)) during ESL experiments was quantitatively studied. As undercooling increases, primary Tile intermetallic compound evolves from coarse dendrites to refined equiaxed grains, whose volume fraction rises significantly. The growth velocity of primary Tile phase increases according to a power relation with undercooling to a maximum of 170 mm 's, which agrees well with the calculated results from LKT/BCT model on the basis of above determined thermophysical properties. The inter-correlations among undercooling-microstructure-hardness were derived subsequently through experiments. The hardness of both primary TiFe intermetallic compound and Ti63.64Fe36.36 alloy increases almost linearly with the increase of undercooling, and the former one relates to its grain size by Hall-Petch function. (C) 2018 Elsevier Ltd. This is an open access article under the CC BY-NC-ND license.

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