4.4 Article

Nonvolatile Electrochemical Metallization Memory Based on Nanocrystalline La2O3 Solid Electrolyte Thin Film

Journal

IEEE JOURNAL OF THE ELECTRON DEVICES SOCIETY
Volume 3, Issue 3, Pages 158-163

Publisher

IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC
DOI: 10.1109/JEDS.2015.2412937

Keywords

Nanocrystalline La2O3 thin films; conductive filaments; resistance change; electrochemical metallization memories (ECM); resistance random access memory (RRAM)

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Nanocrystalline La2O3 thin films are deposited on Pt/Ti/SiO2/Si substrate by reactive radio frequency magnetron sputtering. The Ag/La2O3/Pt devices exhibit reversible bipolar resistance change over 1000 cycles with a resistance ratio (high resistance state to low resistance state) of over three orders of magnitude and stable retention for over 10(6) s at room temperature. Analysis indicates that the resistance change originates from the formation/rupture of Ag filaments in the La2O3 thin films, which act as a solid electrolyte. The device shows potential for multilevel storage as well as low power consumption applications.

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