Journal
PHOTONICS RESEARCH
Volume 2, Issue 3, Pages A1-A7Publisher
OPTICAL SOC AMER
DOI: 10.1364/PRJ.2.0000A1
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Funding
- Japan Society for the Promotion of Science (JSPS) through its Funding Program for World-Leading Innovative R&D on Science and Technology (FIRST Program)
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One of the most serious challenges facing exponential performance growth in the information industry is the bandwidth bottleneck in interchip interconnects. We propose a photonics-electronics convergence system in response to this issue. To demonstrate the feasibility of the system, we fabricated a silicon optical interposer integrated with arrayed laser diodes, spot-size converters, optical splitters, optical modulators, photodetectors, and optical wave-guides on a single silicon substrate. Using this system, 20 Gbps error-free data links and a 30 Tbps/cm(2) bandwidth density were achieved. This bandwidth density is sufficient to meet the interchip interconnect requirements for the late 2010s. (C) 2014 Chinese Laser Press
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