From an Organometallic Monolayer to an Organic Monolayer Covered by Metal Nanoislands: A Simple Thermal Protocol for the Fabrication of the Top Contact Electrode in Molecular Electronic Devices

In this contribution, a novel method for practical uses in the fabrication of the top contact electrode in a metal/organic monolayer/metal device is presented. The procedure involves the thermally induced decomposition of an organometallic compound, abbreviated as the TIDOC method. Monolayers incorporating the metal organic compounds (MOCs) [[4-{(4-carboxy) ethynyl} phenyl] ethynyl]-(triphenylphosphine)-gold, 1, or [1-isocyano-4-methoxybenzene]-[4-amino-phenylethynyl]-gold, 2, were annealed at moderate temperatures (1: 150 degrees C for 2h and 2: 100 degrees C for 2 h), resulting in cleavage of the Au-P or Au-C bond and reduction of Au(I) to Au(0) as metallic gold nanoparticles (GNPs). These particles are distributed on the surface of the film resulting in formation of metal/molecule/GNP sandwich structures. Electrical properties of these nascent devices were determined by recording I-V curves with a conductive-AFM. The I-V curves collected from these metal/organic monolayer/GNPs sandwich structures are typical of metal-moleculemetal junctions, with no low resistance traces characteristic of metallic short circuits observed over a wide range of set-point forces. The TIDOC method is therefore an effective procedure for the fabrication of molecular junctions for the emerging area of molecular electronics.