Journal
JOURNAL OF MATERIALS CHEMISTRY C
Volume 2, Issue 46, Pages 9805-9812Publisher
ROYAL SOC CHEMISTRY
DOI: 10.1039/c4tc01549e
Keywords
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Funding
- Ministry of Science and Technology [101-2112-M-007-015-MY3, 101-2218-E-007-009-MY3, 102-2633-M-007-002, 102-2221-E-007-048-MY3]
- National Tsing Hua University [102N2701E1]
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Dense nanoscale twins were introduced into Cu films and nanowires through bombardment with highenergy Ar+ ions at low temperatures. Both the twin boundary density and indentation hardness of the ion-irradiated Cu films increased with decreases in the bombardment temperature. The improved mechanical strength in the ion-irradiated Cu films is attributed to twin boundary-dislocation and dislocation-dislocation interactions. The strengthened region is several hundreds of nanometers beneath the surface of the bombarded nanowires and thin strips. A mechanism based on irradiation-induced thermal spike cascades is proposed to explain the influence of the energy of the Ar+ ions and bombardment temperature on nanoscale twinning in crystalline Cu. This study provides a route to developing advanced interconnection technology for micro- and nanoelectronic devices.
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