Journal
JOURNAL OF MATERIALS CHEMISTRY A
Volume 2, Issue 8, Pages 2478-2481Publisher
ROYAL SOC CHEMISTRY
DOI: 10.1039/c3ta14645f
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Funding
- Fundamental R&D Program for Core Technology of Materials by the Ministry of Knowledge Economy
- Ministry of Trade, Industry and Energy, Republic of Korea
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We report a simple two-step fabrication process of 3D porous Si/copper films by an electrodeposition method using a hydrogen gas bubble template. A 3D porous Si/copper film provides a large surface area, a highly conductive pathway, a short ion diffusion length, and buffer spaces to accommodate the stress during the cycling processes.
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