Journal
ECS JOURNAL OF SOLID STATE SCIENCE AND TECHNOLOGY
Volume 3, Issue 4, Pages Q42-Q54Publisher
ELECTROCHEMICAL SOC INC
DOI: 10.1149/2.007403jss
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Hydrophilically activated direct wafer bonding is a technique for gluelessly attaching oxide-coated wafers together. This ability is a vital step in the construction of many microelectronic and microelectromechanical (MEMS) devices. In particular this technique is widely used in the production of 3d interconnected devices due to the lack of interlayer. (C) 2014 The Electrochemical Society. All rights reserved.
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