Related references
Note: Only part of the references are listed.Low Temperature Direct Bonding of InP and Si3N4-Coated Silicon Wafers for Photonic Device Integration
Yadong Wang et al.
JOURNAL OF THE ELECTROCHEMICAL SOCIETY (2012)
Electrically driven hybrid Si/III-V Fabry-Perot lasers based on adiabatic mode transformers
B. Ben Bakir et al.
OPTICS EXPRESS (2011)
Low Temperature Wafer Bonding of Low-kappa Carbon-Doped Oxide for Application in 3D Integration
C. S. Tan et al.
ELECTROCHEMICAL AND SOLID STATE LETTERS (2010)
Transfer of InP thin films from engineered porous silicon substrates
Monali B. Joshi et al.
JOURNAL OF APPLIED PHYSICS (2010)
Designer spoof surface plasmon structures collimate terahertz laser beams
Nanfang Yu et al.
NATURE MATERIALS (2010)
Quantum cascade lasers that emit more light than heat
Yanbo Bai et al.
NATURE PHOTONICS (2010)
Thermal characteristic of Cu-Cu bonding layer in 3-D integrated circuits stack
Chuan Seng Tan
MICROELECTRONIC ENGINEERING (2010)
Operational upsets and critical new bit errors in CMOS digital inverters due to high power pulsed electromagnetic interference
Kyechong Kim et al.
SOLID-STATE ELECTRONICS (2010)
High-Quality 150 mm InP-to-Silicon Epitaxial Transfer for Silicon Photonic Integrated Circuits
D. Liang et al.
ELECTROCHEMICAL AND SOLID STATE LETTERS (2009)
Highly efficient vertical outgassing channels for low-temperature InP-to-silicon direct wafer bonding on the silicon-on-insulator substrate
D. Liang et al.
JOURNAL OF VACUUM SCIENCE & TECHNOLOGY B (2008)
Photonic crystal lasers in InGaAsP on a SiO2/Si substrate and its thermal impedance
M. H. Shih et al.
OPTICS EXPRESS (2007)
Electrically pumped hybrid AlGaInAs-silicon evanescent laser
Alexander W. Fang et al.
OPTICS EXPRESS (2006)
Surface-emitting microlaser combining two-dimensional photonic crystal membrane and vertical Bragg mirror
B Ben Bakir et al.
APPLIED PHYSICS LETTERS (2006)
InP dies transferred onto silicon substrate for optical interconnects application
M Kostrzewa et al.
SENSORS AND ACTUATORS A-PHYSICAL (2006)
Ultra-thin benzocyclobutene bonding of III-V dies onto SOI substrate
G Roelkens et al.
ELECTRONICS LETTERS (2005)
Thin-film devices fabricated with benzocyclobutene adhesive wafer bonding
I Christiaens et al.
JOURNAL OF LIGHTWAVE TECHNOLOGY (2005)
Plasma-assisted InP-to-Si low temperature wafer bonding
D Pasquariello et al.
IEEE JOURNAL OF SELECTED TOPICS IN QUANTUM ELECTRONICS (2002)
Optical interconnects to silicon
DAB Miller
IEEE JOURNAL OF SELECTED TOPICS IN QUANTUM ELECTRONICS (2000)
Share Paper
