Journal
BEILSTEIN JOURNAL OF NANOTECHNOLOGY
Volume 3, Issue -, Pages 101-113Publisher
BEILSTEIN-INSTITUT
DOI: 10.3762/bjnano.3.11
Keywords
electrochemical nanotechnology; electrodeposition; lithography; metallic nanostructures; self-assembled monolayers; thiols
Funding
- EPSRC [SCH0-YEP061, EP/I004602/1]
- EPSRC [EP/E061303/1, EP/I004602/1] Funding Source: UKRI
- Engineering and Physical Sciences Research Council [EP/E061303/1, EP/I004602/1] Funding Source: researchfish
Ask authors/readers for more resources
Self-assembled monolayers (SAMs) of 4'-methylbiphenyl-4-thiol (MBP0) adsorbed on polycrystalline gold substrates served as templates to control electrochemical deposition of Cu structures from acidic solution, and enabled the subsequent lift-off of the metal structures by attachment to epoxy glue. By exploiting the negative-resist behaviour of MBP0, the SAM was patterned by means of electron-beam lithography. For high deposition contrast a two-step procedure was employed involving a nucleation phase around -0.7 V versus Cu2+/Cu and a growth phase at around -0.35 V versus Cu2+/Cu. Structures with features down to 100 nm were deposited and transferred with high fidelity. By using substrates with different surface morphologies, AFM measurements revealed that the roughness of the substrate is a crucial factor but not the only one determining the roughness of the copper surface that is exposed after lift-off.
Authors
I am an author on this paper
Click your name to claim this paper and add it to your profile.
Reviews
Recommended
No Data Available