Journal
IEEE TRANSACTIONS ON TERAHERTZ SCIENCE AND TECHNOLOGY
Volume 5, Issue 2, Pages 197-206Publisher
IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC
DOI: 10.1109/TTHZ.2015.2397274
Keywords
Silicon micromachining; terahertz (THz) imaging radar; transceiver array
Funding
- Department of Homeland Security Science and Technology Directorate
- National Aeronautics and Space Administration
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An eight-pixel transceiver array for operation in a 340 GHz imaging radar is presented. Silicon micromachining is applied to fabricate the submillimeter-wave front-end components to increase the density and uniformity of the array while lowering the cost compared to metal machining. Performance comparable with discrete metal machined housings was achieved with the 340 GHz transmitter nominally producing 0.5 mW and the mixers having a DSB noise temperature of 2000 K with a conversion loss of 8 dB. Radar performance is primarily limited by the isolation of the hybrid coupler, which is typically 28 dB, but excellent imaging performance is still achieved and improvements in penetration compared to higher frequency imaging radars is demonstrated.
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