Journal
VACUUM
Volume 86, Issue 9, Pages 1328-1332Publisher
PERGAMON-ELSEVIER SCIENCE LTD
DOI: 10.1016/j.vacuum.2011.12.008
Keywords
Indium nitride; Molecular beam epitaxy; Hardness; Nanoindentation
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In this study, we used an RF plasma-assisted molecular beam epitaxy (RF-MBE) system to grow single-crystalline indium nitride (InN) films onto aluminum nitride (AlN) buffer layers on Si (111) substrates. We then used nanoindentation techniques and reflection high-energy electron diffraction (RHEED) to study the influence of the c-axis-oriented InN films on the mechanical performance. From morphological observations, we compared the stiffness and resistance against contact-induced damage of the InN films in the presented shrinkage of the area. InN films prepared at growth temperatures of 440, 470, and 500 degrees C had nanohardnesses (H) of 3.6 +/- 0.2, 4.5 +/- 0.25, and 9.1 +/- 0.8 GPa, respectively, and Young's moduli (E) of 97.4 +/- 1.2, 147.7 +/- 1.8, and 176.0 +/- 2.3 GPa, respectively. (C) 2012 Elsevier Ltd. All rights reserved.
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