Journal
TRIBOLOGY LETTERS
Volume 46, Issue 1, Pages 95-100Publisher
SPRINGER/PLENUM PUBLISHERS
DOI: 10.1007/s11249-012-9924-9
Keywords
Non-ferrous alloys; Grinding; SEM; TEM; Wear mechanisms
Categories
Funding
- National Natural Science Foundation of China [91123013]
- Science and Technology Project of Dalian City of China [2009A18GX014]
Ask authors/readers for more resources
Damage-free subsurfaces of soft-brittle HgCdTe (MCT) single crystals were directly achieved after nanogrinding by a developed ultrafine diamond wheel. This is different from those of hard-brittle semiconductors, where there is usually a damaged layer found after mechanical machining. Two chips induced by nanogrinding with thicknesses varying from 23 to 27.1 nm attached on the ground MCT surface were observed, which is consistent well with a proposed model of chip thickness. Nanoscale material removal mechanism was investigated using high resolution transmission electron microscopy. Twins and nanocrystals were observed within the chips found.
Authors
I am an author on this paper
Click your name to claim this paper and add it to your profile.
Reviews
Recommended
No Data Available
Share Paper
