Journal
TRANSACTIONS OF NONFERROUS METALS SOCIETY OF CHINA
Volume 23, Issue 6, Pages 1701-1708Publisher
ELSEVIER SCIENCE BV
DOI: 10.1016/S1003-6326(13)62651-5
Keywords
wetting; diamond/Cu composites; Ag-Cu-Ti brazing filler; reactive brazing; shear strength
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Funding
- National Natural Science Foundation of China [51204016]
- Specialized Research Fund for the Doctoral Program of Higher Education of China [20120006120011]
- Fundamental Research Funds for the Central Universities, China [FRF-TP-12-154A]
- National Science Foundation for Post-doctoral Scientists of China [11175020]
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The novel properties of diamond/Cu composites such as low thermal expansion coefficient and high thermal conductivity have rendered the composites a valuable packaging material. The reactive brazing of diamond/Cu composites and alumina was performed using the 97%(72Ag-28Cu)-3%Ti alloy. The reactive brazing alloy displays good Wettability with alumina and diamond film, and the equilibrium contact angle on both the substrates is found to be less than 5 degrees. The influence of main bonding conditions such as peak heating temperature and holding time was investigated in detail. It is found that Ti element concentrates at the surface of diamond particle resulting in the formation of TiC compound. The morphology of TiC compound exhibits a close relationship with the shear strength of brazing joint. It is surmised that an optimal thickness of TiC layer on the diamond particle surface can ameliorate the shear strength of brazing joint. However, on the contrary, the particle-like shaped TiC compound or a thicker TiC compound layer can impair the shear strength. The maximum shear strength is found to be 117 MPa.
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