Journal
THERMOCHIMICA ACTA
Volume 568, Issue -, Pages 130-139Publisher
ELSEVIER SCIENCE BV
DOI: 10.1016/j.tca.2013.06.038
Keywords
Epoxy acrylate resin; Thermal stability; UV-curing; Thiol-ene photopolymerization; Octamercaptopropyl polyhedral oligomeric silsesquioxane; Nanocomposites
Funding
- National Basic Research Program of China (973 Program) [2012CB719701]
- National Natural Science Foundation of China [51036007]
- Fundamental Research Funds for the Central Universities [WK2320000007]
- NSFC [61079015]
- CAAC [61079015]
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UV-curable epoxy acrylate (EA) modified with octamercaptopropyl polyhedral oligomeric silsesquioxane (OMP-POSS) was prepared via thiol-ene photopolymerization. The study of microscale combustion indicated that EA/POSS nanocomposite displayed both the slower heat release rate and lower total heat release. The result of thermal degradation of the cured films showed that OMP-POSS had a double effect on the thermal stability of EA due to its structure containing both the relatively weak mercapto moieties and the POSS core resistant to heat shock, the derivation from the former (thioether linkages) leading to the early decomposition of the nanocomposites whereas the latter providing the well protective effects on some moieties of EA like aromatic groups and on the carbonaceous char. The analysis for the residues of EA2 with 20 wt% OMP-POSS exhibited that POSS can well protect the carbonaceous char from thermal-oxidative degradation at 600 degrees C, but do not work at 800 degrees C. (C) 2013 Elsevier B.V. All rights reserved.
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