Journal
SYNTHETIC METALS
Volume 160, Issue 17-18, Pages 1981-1986Publisher
ELSEVIER SCIENCE SA
DOI: 10.1016/j.synthmet.2010.07.021
Keywords
Epoxy; Polyaniline; Conductive adhesive; Thermosets; Dielectric properties
Funding
- Conselho Nacional de Desenvolvimento Cientifico e Tecnologico-CNPq
- Coordenacao de Aperfeicoamento de Pessoal de Ensino Superior-CAPES
- Fundacao de Amparo a Pesquisa do Estado do Rio de Janeiro-FAPERJ
- Third World Academy of Science (TWAS)-UNESCO
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Electrically conductive adhesives based on epoxy-anhydride system containing polyaniline (PAni) doped with dodecylbenzenesulfonic acid (DBSA) have been successfully developed and characterized. The blends were prepared by physical mixing and by in situ polymerization of aniline within epoxy matrix. The in situ polymerization procedure contributes for the formation of a conducting pathway with lower amount of PAni.DBSA. A conductivity as low as 10(-3) S cm(-1) with 12 wt% of PAni and excellent adhesion properties were achieved with these systems. The microstructure of the conductive adhesives was studied by means of scanning electron microscopy (SEM). In the case of blends prepared by in situ polymerization, PAni.DBSA is dispersed within the epoxy matrix in the form of microtubules. Dielectrical properties as a function of frequency and temperature have also indicated a great interaction between polyaniline and epoxy matrix by in situ polymerization procedure. (C) 2010 Elsevier B.V. All rights reserved.
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