Journal
SURFACE & COATINGS TECHNOLOGY
Volume 256, Issue -, Pages 52-58Publisher
ELSEVIER SCIENCE SA
DOI: 10.1016/j.surfcoat.2014.01.027
Keywords
Plasma immersion ion implantation; Deposition; Copper; Titanium; XPS; Copper release
Funding
- Federal Ministry of Education and Research of Germany, Pilot Project Campus PlasmaMed (subproject PlasmaImp) [13N9775, 13N9779, 13N11188]
- program TEAM of Mecklenburg-Vorpommern
- Helmholtz Association in Germany (VH-MV1) [UR 0402210]
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Antimicrobial equipped surfaces of titanium (Ti-6Al-4V) implants are beneficial to prevent implant-associated infections of total joint endoprostheses and osteosyntheses. Copper (Cu) is well suited for this purpose, since it exhibits a well-known antimicrobial activity and can be found as a trace element in the human body, i.e. it is nontoxic in small concentrations. For this approach plasma immersion ion implantation and deposition (PIII&D) of Cu into Ti was evaluated. The amount and also the depth-profile of implanted and deposited Cu in and on the surface were analyzed by X-ray photoelectron spectroscopy (XPS) and ball cratering tests. The layer morphology was studied using scanning electron microscopy (SEM). The surfaces released up to 3.2 mmol/l of Cu within 24 h, measured with atomic absorption spectroscopy (AAS). Such Cu doped and coated Ti implants could be useful for prevention and therapy of implant-associated infections. (C) 2014 Elsevier B.V. All rights reserved.
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